TI公司的TAS2764是具有扬声器IV检测的数字输入单声道D类音频放大器,能有效在小性扬声器驱动大峰值功率.D类放大器能在4 Ω负载提供13W连续功率,在电源12V时THD+N小于1%.器件采用Y桥架构改善了低功率输出和空闲模式时的整体效率.集成的扬声器电压和电流检测提供了扬声器行为的实时监测.电源跟踪峰值电压限制器优化了放大器预留空间.有多个阈值的电压不足保护方案允许在电压下降时降低信号通路的增益.TAS2764的超声波支持所用的器件用于先进的超声波应用如运动和接近检测,手势识别等.多达8个TAS2764通过I2S/TDM和I2C接口共享共同总线.1W时的效率为81%,3W时的效率为85%,噪声门模式的电流为3mA,硬件关断模式的电流<1uA.器件采用30点0.4mm间隔CSP封装.主要用在便携式计算机,平板电脑,无线扬声器和消费类音频设备.本文介绍了TAS2764主要特性, 功能框图和电路图,应用电路图和评估模块TAS2764EVM主要特性,电路图,材料清单和PCB设计图.

The TAS2764 is a mono digital input Class-D audioamplifier optimized for efficiently driving high peakpower into small loudspeakers. The Class-D amplifieris capable of delivering 13 W of continuous power intoa 4 Ω load with less than 1 % THD+N at a supply

voltage of 12 V.

Y-Brige architecture improves overall efficiency at lowlevel of output power and in idle mode.Integrated speaker voltage and current senseprovides for real time monitoring of loudspeakerbehavior. A supply tracking peak voltage limiteroptimizes amplifier headroom. Brownout preventionscheme with multiple thresholds allows reducing the

gain in signal path when the supply drops.

TAS2764 ultrasonic output support allows deviceto be used for advance ultrasonic applications likemotion and proximity detection, gesture recognition,etc.

Up to eight TAS2764 devices can share a commonbus via I2S/TDM and I2C interfaces.

The device is available in a 30-ball, 0.4 mm pitch CSPfor a compact PCB footprint.

TAS2764主要特性:

• Key Features

– Y-Bridge Power Architecture

– Edge and Spread Spectrum Control

– Full Scale Ultrasonic Output up to 40 kHz

• Output Power (1 % THD+N)

– 13 W (4 Ω, 12 V)

– 8 W (8 Ω, 12 V)

• Power Consumption (1 % THD+N, 4 Ω, 12 V)

– 81% Efficient at 1W

– 85% Efficient at 13W

– 3mA in Noise Gate Mode

– <1ua in Hardware Shutdown Mode

• Power Supplies and Management

– PVDD: 2.3 V to 16 V

– VBAT1S: 2.3 V to 5.5 V

– AVDD: 1.8 V

– IOVDD: 1.2 V/ 1.8 V

– Brownout Protection

– PVDD Tracking Peak Voltage Limiter

• Interfaces and Control

– SDOUT and I2S Feedback for Echo

Cancellation

– I2S/TDM: 8 Channels of 32-bit up to 96 kHz

– I2C: 8 addresses with Fast Mode Plus Support

– 44.1 kHz to 96 kHz Sample Rates

– Inter Chip Communication Bus

• Integrated Speaker Management and Protection

– Speaker Voltage and Current Sense

– Short and Open Detection

– Thermal and Over Current Protection

– Over Power Protection

TAS2764应用:

• Laptop Computers

• Tablets

• Wireless Speakers

• Smart Speakers

• Consumer Audio Devices

图1.TAS2764电路图

图2.TAS2764功能框图

图3.TAS2764典型应用:数字音频输入

图3所推荐外接元件数值表:

评估模块TAS2764EVM

The TAS2764 is a mono digital input Class-D audio amplifier optimized for efficiently driving high peak power intosmall loudspeakers. The Class-D amplifier is capable of delivering 13 W of continuous power into a 4 Ω load withless than 1 % THD+N at a supply voltage of 12 V.

Y-Brige architecture improves overall efficiency at low level of output power and in idle mode. Integrated speakervoltage and current sense provides for real time monitoring of loudspeaker behavior. A supply tracking peakvoltage limiter optimizes amplifier eadroom. Brownout prevention scheme with multiple thresholds allowsreducing the gain in signal path when the supply drops.

Up to eight devices can share a common bus via I2S/TDM and I2C interfaces. The device is available in a30-ball, 0.4 mm pitch CSP for a compact PCB footprint.

TAS2764EVM supports evaluation and development with the TAS2764 device through the following interfaces:

• USB Interface

• Software control via PurePath™ Console 3 (PPC3) GUI, USB-HID

• USB-class audio device, compatible with Microsoft® Windows® 7+

• External 100-mil headers

• PSIA – I2S/TDM interface

• I2C

• Hardware Shutdown Control

• Interrupt Output

图4.评估模块TAS2764EVM外形图(3D):正面

图5.评估模块TAS2764EVM外形图(3D):背面

图6.评估模块TAS2764EVM外形图(3D):分布图

图7.评估模块TAS2764EVM电路图(1)

图8.评估模块TAS2764EVM电路图(2)

图9.评估模块TAS2764EVM电路图(3)

图10.评估模块TAS2764EVM电路图(4)

图11.评估模块TAS2764EVM电路图(5)

图12.评估模块TAS2764EVM电路图(6)

图13.评估模块TAS2764EVM电路图(7)

评估模块TAS2764EVM材料清单:

图14.评估模块TAS2764EVM PCB设计图:顶层丝印图

图15.评估模块TAS2764EVM PCB设计图:顶层焊接图

图16.评估模块TAS2764EVM PCB设计图:顶层走线

图17.评估模块TAS2764EVM PCB设计图:铜层2

图18.评估模块TAS2764EVM PCB设计图:铜层3

图19.评估模块TAS2764EVM PCB设计图:铜层4

图20.评估模块TAS2764EVM PCB设计图:铜层5

图21.评估模块TAS2764EVM PCB设计图:底层

图22.评估模块TAS2764EVM PCB设计图:底层焊接图

图23.评估模块TAS2764EVM PCB设计图:底层综合